CerDIP - IC Package Types

CERDIP

The Ceramic Dual In-line Package, or CerDIP is one of the most mature IC packages still in use today. It is a rectangular ceramic package that has leads extending from both of its longer sides, thus forming two sets of in-line pins.

Figure 1. Example of a CerDIP

The CerDIP is a hermetically sealed package that keeps out moisture and contaminants once it is sealed. The CerDIP package is composed of an upper part called the cap, and a lower part called the base. The base has a cavity where the microchip is mounted. The base is covered by the cap and then sealed with molten seal glass. The seal glass provides a good hermetic seal once it has cooled down and solidified, which is why hermetic packages such as the CerDIP are used in military grade devices.

CerDIP lead counts range from 8 to 40. CerDIP's typically come in two body widths: the narrow body which is typically slightly less than 300 mils wide and the wide body which is typically slightly less than 600 mils wide. The lead pitch of a cerdip package is typically 100 mils.

Table 1. Properties of Some Examples of CerDIP's

Lead Count	Width	Length
8	275 mils	390 mils
14	275 mils	760 mils
16	288 mils	760 mils
20	288 mils	950 mils
28	577 mils	1450 mils
40	577 mils	2050 mils

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